EVAL-ADUM5401 Datasheet, PDF (3/8 Pages) Analog Devices – Quad Isolators with isoPower Evaluation Board

EVALUATION BOARD HARDWARE
PAD LAYOUT FOR THE DUT
The evaluation board has a pad layout in U2 that accommo-
dates SOP16 wide body devices as shown in Figure 2. Power
and ground connections connect to capacitor pads for Side 1
and Side 2.
U2
C1
C2
C3
C4
Figure 2. DUT Pad Layout Component U2
Three low inductance, surface-mount bypass capacitors are
provided for each side. A 100 nF capacitor is installed on each
side in Capacitor C2 and Capacitor C3.
In addition, there are 10 μF ceramic X7R capacitors, C1 on Side 1
and C4 on Side 2, that provide high frequency bypassing and
ripple reduction. For further ripple reduction in isoPower™
devices like the ADuM540x, tantalum capacitors are added to
C10 as a 68 μF value on Side 1 and to C5 as a 22 μF value on
Side 2. These large value ceramic and tantalum bypass
capacitors are not necessary for non-isoPower devices.
Many of the iCoupler devices have configuration pins that allow
outputs to be disabled or default levels to be set. These pins are
usually located at Pin 7 and Pin 10 in the wide body package.
Pull-up 0 Ω resistors on SM Pad R4 and and SM Pad R17 have
been provided to pull these pins high. If desired, these pull-up
resistors can be removed and pull-down resistors can be
installed on R5 and R18.
In addition to the U2 DUT space, an additional pad layout is
provided at U1, specifically to accommodate another isoPower
device, as shown in Figure 3. This is a power supply only device
that can be used to provide secondary power for any iCoupler,
in standalone mode or as a slave, to boost power to the
ADuM540x or ADuM520x devices. The surface-mount resistor
pads to control these functions are not populated.
Pad layout for the ADuM5000 is provided in U1, but this part is
not populated. As can be seen in Figure 3, the power and ground
connections for this device are different from the rest of the
iCoupler components. Bypass capacitor Pad C6 through Pad C9
are provided but not populated (0.1 μF X7R ceramic capacitors
are recommended). Pull-up, pull-down, and connecting resistor
pads are provided (but not populated) to connect the ADuM5000
in master or slave mode, as well as to set the output voltage.
EVAL-ADuM5401-ADuM5404
C6
U1
C9
C8
C7
Figure 3. ADuM5000 Pad Layout Component U1
Grounding Scheme
The board consists of two separate ground and power systems.
Each side of the DUT can be operated from an independent
power and ground reference. This allows simulation of
conditions similar to the target application. The board provides
for board creepage and clearance typical of most 2.5 kV circuit
boards. It is not recommended for use above 2.5 kV rms transient
voltages.
EMI and EMC Measurements
The signal path has been made as simple as possible while still
providing flexibility. The board is not intended for detailed
characterization of system noise, EMI, or EMC. It may be useful
for initial bench work in these areas, but Analog Devices, Inc.,
does not guarantee that board results will be indicative of the
final system performance in these areas.
TERMINALS
Side 1 Power Supply Inputs
Power is supplied to the board via a set of terminal block
connectors labeled IO_1C, as shown in Figure 4. Power is
connected to the top terminal Pin 1, and ground is connected to
the top terminal Pin 2. Provisions for adding in line inductors
for noise isolation have been made with the inclusion of Z1 and
Z2, which are 1206 size surface-mount components. These
positions are populated with 0 Ω resistors to connect power to
the board. If isolation inductors are required, these components
should be removed and replaced at your discretion.
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