AD5689 Datasheet, PDF (24/24 Pages) Analog Devices – Dual, 16-/12-Bit nanoDAC+ with SPI Interface

AD5689/AD5687
Data Sheet
OUTLINE DIMENSIONS
PIN 1
INDICATOR
0.80
0.75
0.70
SEATING
PLANE
3.10
3.00 SQ
2.90
TOP VIEW
0.50
BSC
0.30
0.23
0.18
13
12
16
1
EXPOSED
PAD
PIN 1
INDICATOR
1.75
1.60 SQ
1.45
9
4
0.50
8
5
0.25 MIN
0.40
BOTTOM VIEW
0.30
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.
Figure 47. 16-Lead Lead Frame Chip Scale Package [LFCSP_WQ]
3 mm × 3 mm Body, Very Very Thin Quad
(CP-16-22)
Dimensions shown in millimeters
5.10
5.00
4.90
ORDERING GUIDE
Model¹
Resolution
AD5689BCPZ-RL7 16 Bits
AD5689BRUZ
16 Bits
AD5689BRUZ-RL7 16 Bits
AD5687BCPZ-RL7 12 Bits
AD5687BRUZ
12 Bits
AD5687BRUZ-RL7 12 Bits
1 _{Z = RoHS Compliant Part.}
16
9
4.50
4.40
4.30
1
6.40
BSC
8
PIN 1
1.20
0.15
MAX
0.20
0.05
0.09
0.75
0.30
8°
0.60
0.65
BSC
0.19 SEATING
PLANE
0°
0.45
COPLANARITY
0.10
COMPLIANT TO JEDEC STANDARDS MO-153-AB
Figure 48. 16-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-16)
Dimensions shown in millimeters
Temperature Range
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
−40°C to +105°C
Accuracy
±2 LSB INL
±2 LSB INL
±2 LSB INL
±1 LSB INL
±1 LSB INL
±1 LSB INL
Package Description
16-Lead LFCSP_WQ
16-Lead TSSOP
16-Lead TSSOP
16-Lead LFCSP_WQ
16-Lead TSSOP
16-Lead TSSOP
PackageOption
CP-16-22
RU-16
RU-16
CP-16-22
RU-16
RU-16
Branding
DKW
DL0
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D11255-0-2/13(0)
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