AD8638_07 Datasheet, PDF (17/20 Pages) Analog Devices – 16 V Auto-Zero, Rail-to-Rail Output Operational Amplifiers

2.48
3.00
2.38
BSC SQ
2.23
5
8
INDEX
AREA
0.80
0.75
0.70
TOP VIEW
0.80 MAX
0.55 NOM
SEATING
PLANE
0.30 _{0.50 BSC}
0.25
0.18
0.50
0.40
0.30
EXPOSED
PAD
4
1
BOTTOM VIEW
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.20 REF
1.74
1.64
1.49
PIN 1
INDICATOR
(R 0.2)
COMPLIANT TO JEDEC STANDARDS MO-229-WEED-4
Figure 58. 8-Lead Lead Frame Chip Scale Package [LFCSP_WD]
3 mm × 3 mm Body, Very Very Thin, Dual Lead
(CP-8-5)
Dimensions shown in millimeters
ORDERING GUIDE
Model
AD8638ARJZ-R2¹
AD8638ARJZ-REEL¹
AD8638ARJZ-REEL7¹
AD8638ARZ¹
AD8638ARZ-REEL¹
AD8638ARZ-REEL7¹
AD8639ACPZ-R2¹
AD8639ACPZ-REEL¹
AD8639ACPZ-REEL7¹
AD8639ARZ¹
AD8639ARZ-REEL¹
AD8639ARZ-REEL7¹
AD8639ARMZ-R2¹
AD8639ARMZ-REEL¹
1 _{Z = RoHS Compliant Part.}
Temperature Range
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
−40°C to +125°C
Package Description
5-Lead SOT-23
5-Lead SOT-23
5-Lead SOT-23
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead LFCSP_WD
8-Lead LFCSP_WD
8-Lead LFCSP_WD
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead SOIC_N
8-Lead MSOP
8-Lead MSOP
Package Option
RJ-5
RJ-5
RJ-5
R-8
R-8
R-8
CP-8-5
CP-8-5
CP-8-5
R-8
R-8
R-8
RM-8
RM-8
AD8638/AD8639
Branding
A1T
A1T
A1T
A1Y
A1Y
A1Y
A1Y
A1Y
Rev. C | Page 17 of 20