OP77_15 Datasheet, PDF (15/16 Pages) Analog Devices – Next Generation OP07 Ultralow Offset Voltage Operational Amplifier

OUTLINE DIMENSIONS
0.005 (0.13) _{0.055 (1.40)}
MIN
MAX
8
5
0.310 (7.87)
0.220 (5.59)
1
4
0.100 (2.54) BSC
0.405 (10.29) MAX
0.200 (5.08)
MAX
0.200 (5.08)
0.125 (3.18)
0.023 (0.58)
0.014 (0.36)
0.070 (1.78)
0.030 (0.76)
0.060 (1.52)
0.015 (0.38)
0.320 (8.13)
0.290 (7.37)
0.150 (3.81)
MIN
SEATING
PLANE
15°
0°
0.015 (0.38)
0.008 (0.20)
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 39. 8-Lead Ceramic Dual In-Line Package [CERDIP]
(Q-8)
Dimensions shown in inches and (millimeters)
REFERENCE PLANE
0.1850 (4.70)
0.1650 (4.19)
0.0400 (1.02) MAX
0.0400 (1.02)
0.0100 (0.25)
0.5000 (12.70)
MIN
0.2500 (6.35) MIN
0.0500 (1.27) MAX
0.1000 (2.54)
BSC
0.1600 (4.06)
0.1400 (3.56)
5
4
6
0.2000
(5.08) 3
BSC
2
0.0190 (0.48)
0.0160 (0.41)
0.0210 (0.53)
0.0160 (0.41)
0.1000
(2.54)
BSC
7
8
1
0.0340 (0.86)
0.0280 (0.71)
45° BSC
0.0450 (1.14)
0.0270 (0.69)
BASE & SEATING PLANE
COMPLIANT TO JEDEC STANDARDS MO-002-AK
CONTROLLING DIMENSIONS ARE IN INCHES; MILLIMETER DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF INCH EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.
Figure 40. 8-Pin Metal Header [TO-99]
(H-08)
Dimensions shown in inches and (millimeters)
OP77
Rev. E | Page 15 of 16