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OP162 Datasheet, PDF (15/16 Pages) Analog Devices – 15 MHz Rail-to-Rail Operational Amplifiers | |||
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OUTLINE DIMENSIONS
OP162/OP262/OP462
8-Lead Standard Small Outline Package [SOIC]
Narrow Body
(RN-8)
Dimensions shown in millimeters and (inches)
5.00 (0.1968)
4.80 (0.1890)
8
4.00 (0.1574)
3.80 (0.1497) 1
5
6.20 (0.2440)
4 5.80 (0.2284)
0.25 (0.0098)
1.27 (0.0500)
BSC
1.75 (0.0688)
1.35 (0.0532)
0.50 (0.0196)
0.25 (0.0099) Ø 45Ø
0.10 (0.0040)
COPLANARITY
0.10
SEATING
PLANE
0.51 (0.0201)
0.33 (0.0130)
8Ø
0.25 (0.0098) 0Ø 1.27 (0.0500)
0.19 (0.0075) 0.41 (0.0160)
COMPLIANT TO JEDEC STANDARDS MS-012AA
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
14-Lead Standard Small Outline Package [SOIC]
Narrow Body
(RN-14)
Dimensions shown in millimeters and (inches)
8.75 (0.3445)
8.55 (0.3366)
4.00 (0.1575) 14
3.80 (0.1496) 1
8 6.20 (0.2441)
7 5.80 (0.2283)
0.25 (0.0098)
0.10 (0.0039)
1.27 (0.0500)
BSC
1.75 (0.0689)
1.35 (0.0531)
0.50 (0.0197)
0.25 (0.0098)Ø 45Ø
COPLANARITY
0.10
0.51 (0.0201) SEATING
0.33 (0.0130) PLANE
8Ø
0.25 (0.0098) 0Ø 1.27 (0.0500)
0.19 (0.0075) 0.40 (0.0157)
CONTROLLING DIMENSIONS ARE IN MILLIMETERS; INCH DIMENSIONS
(IN PARENTHESES) ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR
REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN
8-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-8)
Dimensions shown in millimeters
3.10
3.00
2.90
8
5
4.50
4.40 6.40 BSC
4.30
1
4
PIN 1
0.65
0.15
BSC
0.05
1.20
MAX
8Ø
0.30
COPLANARITY 0.19
0.10
SEATING 0.20
PLANE 0.09
0Ø
0.75
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153AA
14-Lead Thin Shrink Small Outline Package [TSSOP]
(RU-14)
Dimensions shown in millimeters
5.10
5.00
4.90
14
8
4.50
4.40
4.30
1
6.40
BSC
7
PIN 1
1.05
0.65
1.00
BSC
0.80
1.20 0.20
MAX 0.09
0.75
0.15
0.05
0.30
0.19
8Ø
0Ø
SEATING
PLANE
COPLANARITY
0.10
0.60
0.45
COMPLIANT TO JEDEC STANDARDS MO-153AB-1
REV. D
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