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ADP1720-EP Datasheet, PDF (10/12 Pages) Analog Devices – 50 mA, High Voltage, Micropower Linear Regulator
ADP1720-EP
APPLICATIONS INFORMATION
THERMAL CONSIDERATIONS
To guarantee reliable operation, the junction temperature of
the ADP1720-EP must not exceed 125°C. To ensure that the
junction temperature stays below this maximum value, the user
needs to be aware of the parameters that contribute to junction
temperature changes. These parameters include ambient tempera-
ture, power dissipation in the power device, and thermal
resistances between the junction and ambient air (θJA). The θJA
number is dependent on the package assembly compounds used
and the amount of copper to which the GND pins of the package
are soldered on the PCB. Table 5 shows typical θJA values of the
8-lead MSOP package for various PCB copper sizes.
Table 5. Typical θJA Values for ADP1720-EP
Copper Size (mm2)
θJA (°C/W)
25
246
50
216
100
186
300
178
500
169
The junction temperature of the ADP1720-EP can be calculated
from the following equation:
TJ = TA + (PD × θJA)
(3)
where:
TA is the ambient temperature.
PD is the power dissipation in the die, given by
PD = [(VIN – VOUT) × ILOAD] + (VIN × IGND)
(4)
where:
ILOAD is the load current.
IGND is the ground current.
VIN and VOUT are input and output voltages, respectively.
Power dissipation due to ground current is quite small and
can be ignored. Therefore, the junction temperature equation
simplifies to the following:
TJ = TA + {[(VIN – VOUT) × ILOAD] × θJA}
(5)
As shown in Equation 5, for a given ambient temperature,
input-to-output voltage differential, and continuous load
current, there exists a minimum copper size requirement for
the PCB to ensure that the junction temperature does not rise
above 125°C. Figure 19 to Figure 24 show junction temperature
calculations for different ambient temperatures, load currents,
VIN to VOUT differentials, and areas of PCB copper for the
ADP1720-EP.
Data Sheet
140
MAX TJ (DO NOT OPERATE ABOVE THIS POINT)
120
100
80
60
40
20
1mA
5mA
0
0
4
10mA
20mA
8
12
30mA
40mA
16
50mA
(LOAD CURRENT)
20
24
28
VIN – VOUT (V)
Figure 19. 500 mm2 of PCB Copper, TA = 25°C
140
MAX TJ (DO NOT OPERATE ABOVE THIS POINT)
120
100
80
60
40
20
1mA
5mA
0
0
4
10mA
20mA
8
12
30mA
40mA
16
50mA
(LOAD CURRENT)
20
24
28
VIN – VOUT (V)
Figure 20. 300 mm2 of PCB Copper, TA = 25°C
140
MAX TJ (DO NOT OPERATE ABOVE THIS POINT)
120
100
80
60
40
20
1mA
5mA
0
0
4
10mA
20mA
8
12
30mA
40mA
16
50mA
(LOAD CURRENT)
20
24
28
VIN – VOUT (V)
Figure 21. 100 mm2 of PCB Copper, TA = 25°C
Rev. A | Page 10 of 12