MB4532 Datasheet, PDF (4/6 Pages) ABC Taiwan Electronics Corp – HIGH CURRENT MULTILAYER CHIP BEAD

SPECIFICATION FOR APPROVAL
REF : 20090527-A
PAGE: 3
PROD. _{HIGH CURRENT MULTILAYER}
NAME
CHIP BEAD
Ⅵ﹒PACKAGING INFORMATION：
ABC'S DWG NO.
ABC'S ITEM NO.
MB□□□□□□□□L□-□□□
( 1 ) Configuration
T
2.0±0.5
Cover Tape
∮C
G
D
Embossed Carrier
※Carrier tape width : D
P:4 m/m
4 m/m
End
Start
Leader
no component
200 m/m min.
( 2 ) Dimensions
Style
A
07 - 08
178
07 - 12
178
Components
User direction of feed
B
C
D
21±0.8
13
8
21±0.8
13
12
Trailer
no component
400 m/m min.
G
10 ⁺⁰
14 ⁺⁰
Unit:m/m
N
T
50 ^-0
12.5
50 ^-0
16.5
( 3 ) Q'TY & G.W. Per package
Series
MB4532
MB4516
MB3261
MB2029
MB1608
Inner : Reel
Q'TY (pcs)
1,000
2,000
3,000
4,000
4,000
G.W. (gw)
170
180
150
120
90
Style
07 - 12
07 - 12
07 - 08
07 - 08
07 - 08
Q'TY(kpcs)
30
80
120
200
200
Outer : Cartion
G.W. (Kg)
9.3
9.7
8.5
8.5
7.0
Size (cm)
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
41 x 39 x 22
AR-001A