MB4532 Datasheet, PDF (1/6 Pages) ABC Taiwan Electronics Corp – HIGH CURRENT MULTILAYER CHIP BEAD

SPECIFICATION FOR APPROVAL
REF : 20090527-A
PAGE: 1
PROD.
NAME
HIGH CURRENT MULTILAYER
CHIP BEAD
ABC'S DWG NO.
ABC'S ITEM NO.
MB□□□□□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
A
D
D
Series
MB4532
MB4516
MB3261
MB2029
MB1608
A
4.5±0.2
4.5±0.2
3.2±0.2
2.0±0.2
1.6±0.2
B
3.2±0.2
1.6±0.2
1.6±0.2
1.2±0.2
0.8±0.2
Ⅱ﹒SCHEMATIC DIAGRAM：
B
C
1.5±0.2
1.6±0.2
1.1±0.2
0.9±0.2
0.8±0.2
D
0.6±0.4
0.6±0.4
0.6±0.4
0.5±0.3
0.3±0.2
I
G
I
( PCB Pattern )
Unit : m/m
G
H
I
3.0
3.0
1.5
3.0
1.4
1.5
2.2
1.4
1.1
1.0
1.0
1.0
0.7
0.7
0.7
Ⅲ﹒MATERIALS：
a﹒Body：Ferrite
b﹒Internal conductor：Silver or Ag / Pd
c﹒Terminal：Ag/Ni/Sn
d﹒Remark：Products comply with RoHS'
requirements
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Storage temp.：-40℃ ---- +105℃
b﹒Operating temp.：-55℃ ---- +125℃
c﹒Terminal strength：
F
Type
F ( kgf ) Time ( sec )
MB4532
1.5
MB4516
1.0
MB3261
1.0
MB2029
0.6
MB1608
0.5
30±5
d﹒Solderability：
Solder : Sn96.5 / Ag3 / Cu0.5
or equivalent
Solder temp. : 260±5℃
Flux : Rosin
Dip time : 4±1 seconds
AR-001A
a
bc
Peak Temp：260℃ max.
Max time above 230℃ ：50sec max.
Max time above 200℃ ：70sec max.
T empera tu re
Rising Area
Preheat Area
+4.0℃ / sec max.
150 ~ 200℃ / 60 ~ 120 sec
250
200
150
100
50
Reflow Area
+2.0 ~ 4.0℃
/ sec max.
Forced Cooling Area
-(1.0 ~ 5.0)℃ / sec max.
Peak Temperature:
260℃
50sec max.
230℃
70sec max.
0
50
100
150
200
250
Time ( seconds )