CM3225R12ML Datasheet, PDF (1/8 Pages) ABC Taiwan Electronics Corp – WOUND CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF : 20200700810254-0C2-H
PAGE: 1
PROD.
NAME
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
CM3225□□□□L□-□□□
CONFIGURATION & DIMENSIONS
Marking
Inductance code
100
A : 3.2±0.4
m/m
B : 2.5±0.2
m/m
C : 2.2±0.2
m/m
E : 1.0±0.2
F : 0.6+- _00.3
K= K1-K2
m/m
m/m
=0.25 ⁺⁰ m/m
F
F
A
SCHEMATIC DIAGRAM
K1 E K2
B
MATERIALS
a Core Ferrite DR core
b Wire Enamelled copper wire (class H)
c Terminal Cu/Sn
d Encapsulate Epoxy novolac molding compound
e Remark Products comply with RoHS' requirements
1 1.8 1
PCB Pattern
d
a
c
b
GENERAL SPECIFICATION
a Temp. rise 20 max.
b Ambient temp. 100 max.
c Storage temp. -40 ----+125
d Operating temp. -40 ----+125
e Terminal pull strength 1.5 kg min.
f Rated current Current cause
inductance drop within 10%
g Resistance to solder heat 260 .10 secs.
h Resistance to solvent Per MIL-STD-202F
AR-001A
Reflow profile
Peak Temp 250 max.
Max time above 245 20~40sec max.
Max time above 217 60~150sec max.
200 ~250 Average Ramp-up Rate 3
/second max.
Tempe ra tu re
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
150 ~ 200 / 60 ~ 180sec
6 / second max.
250
245
217
200
150
Peak Temperature
250
20~40sec
60~150sec
100
50
0
50
100
150
200
250
Time ( seconds )