CC45321R0KL Datasheet, PDF (1/8 Pages) ABC Taiwan Electronics Corp – WOUND CHIP INDUCTOR

SPECIFICATION FOR APPROVAL
REF : 20071102-D
PAGE: 1
PROD.
NAME
WOUND CHIP INDUCTOR
ABC'S DWG NO.
ABC'S ITEM NO.
CC4532□□□□L□-□□□
Ⅰ﹒CONFIGURATION & DIMENSIONS：
Marking
Inductance code
330K
4.2±0.2
A : 4.5±0.3
m/m
B : 3.2±0.2
m/m
C : 3.2±0.2
m/m
E : 1.2
m/m
F : 1.0+- ^00.3
m/m
F
F
E
A
B
1.5 2.2 1.5
（ PCB Pattern ）
Ⅱ﹒SCHEMATIC DIAGRAM：
d
Ⅲ﹒MATERIALS：
a﹒Core：Ferrite DR core
b﹒Wire ：Enamelled copper wire (class H)
c﹒Terminal：Cu/Sn
d﹒Encapsulate：Epoxy novolac molding compound
e﹒Remark：Products comply with RoHS' requirements
a
c
b
Ⅳ﹒GENERAL SPECIFICATION：
a﹒Temp. rise ：20℃ max.
b﹒Ambient temp.：100℃ max.
c﹒Storage temp.：-40℃ ----+125℃
d﹒Operating temp.：-40℃----+125℃
e﹒Terminal pull strength：1.5 kg min.
f﹒Rated current：Current cause
inductance drop within 10%
g﹒Resistance to solder heat：260℃.10 secs.
h﹒Resistance to solvent：Per MIL-STD-202F
AR-001A
Reflow profile
Peak Temp：250℃ max.
Max time above 245℃ ：20~40sec max.
Max time above 217℃ ：60~150sec max.
200℃~250℃ Average Ramp-up Rate：3℃/second max.
Temperatu re
Rising Area
Preheat Area
Reflow Area
Forced Cooling Area
1 50 ~ 200℃ / 60 ~ 180 sec
6 ℃ / secon d max.
250
245
P eak Temperature：
250℃
217
2 0~40sec
200
150
6 0~1 50sec
100
50
0
50
100
150
200
250
Time ( seconds )