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NLAS4717EP_11 Datasheet, PDF (1/10 Pages) ON Semiconductor – 4.5 High Bandwidth, Dual SPDT Analog Switch | |||
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NLAS4717EP
4.5âW High Bandwidth, Dual
SPDT Analog Switch
The NLAS4717EP is an advanced CMOS analog switch fabricated
in subâmicron silicon gate CMOS technology. The device is a dual
independent Single Pole Double Throw (SPDT) switch featuring low
RDS(on) of 4.5 W at 3.0 V.
The device also features guaranteed BreakâBeforeâMake (BBM)
switching, assuring the switches never short the driver.
The NLAS4717EP is available in two small size packages:
ï¨ Microbump: 2.0 x 1.5 mm
ï¨ WQFNâ10: 1.4 x 1.8 mm
Features
ï· Low RDS(on): 4.5 W @ 3.0 V
ï· Matching Between the Switches ï±0.5 W
ï· Wide Voltage Range: 1.8 V to 5.5 V
ï· High Bandwidth > 90 MHz
ï· 1.65 V to 5.5 V Operating Range
ï· Low Threshold Voltages on Pins 4 and 8 (CTRL Pins)
ï· UltraâLow Charge Injection ï£ 6.0 pC
ï· Low Standby Current: ICC = 1.0 nA (Max) @ TA = 25ï°C
ï· *OVT on Pins 4 and 8 (CTRL Logic Pins)
ï· These are PbâFree Devices
Typical Applications
ï· Cell Phones
ï· PDAs
ï· MP3s
ï· Digital Still Cameras
ï· USB 2.0 Full Speed (USB1.1) â 12 Mbps Compliant
Important Information
ï· ESD Protection:
ï¨ Human Body Model (HBM) = 2500 V,
ï¨ Machine Model (MM) = 200 V
ï· Latchup Max Rating: 200 mA (Per JEDEC EIA/JESD78)
ï· PinâtoâPin Compatible with MAX4717
*OVT
ï· Overvoltage Tolerant (OVT) specific pins operate higher than normal
supply voltages, with no damage to the devices or to signal integrity.
http://onsemi.com
MARKING
DIAGRAMS
A1
Microbumpâ10
CASE 489AA
4717EP
AYWWG
G
A1
A
= Assembly Location
Y
= Year
W, WW = Work Week
G
= PbâFree Package
(Note: Microdot may be in either location)
1
WQFNâ10
CASE 488AQ
AWMG
G
AW = Specific Device Code
M
= Date Code
G
= PbâFree Device
(Note: Microdot may be in either location)
FUNCTION TABLE
IN_
NO_
NC_
0
OFF
ON
1
ON
OFF
ORDERING INFORMATION
Device
Package
Shippingâ
NLAS4717EPFCT1G Microbumpâ10 3000 /
(PbâFree) Tape & Reel
NLAS4717EPMTR2G WQFNâ10
3000 /
(PbâFree) Tape & Reel
â For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
ï£ Semiconductor Components Industries, LLC, 2011
1
October, 2011 â Rev. 7
Publication Order Number:
NLAS4717EP/D
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