NLAS4717EP Datasheet, PDF (1/10 Pages) ON Semiconductor – 4.5 ohm High Bandwidth, Dual SPDT Analog Switch

NLAS4717EP
4.5 W High Bandwidth, Dual
SPDT Analog Switch
The NLAS4717EP is an advanced CMOS analog switch fabricated
in sub−micron silicon gate CMOS technology. The device is a dual
independent Single Pole Double Throw (SPDT) switch featuring low
R_DS(on) of 4.5 W at 3.0 V.
The device also features guaranteed Break−Before−Make (BBM)
switching, assuring the switches never short the driver.
The NLAS4717EP is available in two small size packages:
Microbump: 2.0 x 1.5 mm
WQFN−10: 1.4 x 1.8 mm
Features
• Low R_DS(on): 4.5 W @ 3.0 V
• Matching Between the Switches ±0.5 W
• Wide Voltage Range: 1.8 V to 5.5 V
• High Bandwidth > 90 MHz
• 1.65 V to 5.5 V Operating Range
• Low Threshold Voltages on Pins 4 and 8 (CTRL Pins)
• Ultra−Low Charge Injection ≤ 6.0 pC
• Low Standby Current: I_CC = 1.0 nA (Max) @ T_A = 25°C
• *OVT on Pins 4 and 8 (CTRL Logic Pins)
• These are Pb−Free Devices
Typical Applications
• Cell Phones
• PDAs
• MP3s
• Digital Still Cameras
• USB 2.0 Full Speed (USB1.1) − 12 Mbps Compliant
Important Information
• ESD Protection:
HBM = 2500 V, MM = 200 V
• Latchup Max Rating: 200 mA (Per JEDEC EIA/JESD78)
• Pin−to−Pin Compatible with MAX4717
*OVT
• Overvoltage Tolerant (OVT) specific pins operate higher than normal
supply voltages, with no damage to the devices or to signal integrity.
http://onsemi.com
MARKING
DIAGRAMS
A1
Microbump−10
CASE 489AA
4717EP
AYWWG
G
A1
A
= Assembly Location
Y
= Year
W, WW = Work Week
G
= Pb−Free Package
(Note: Microdot may be in either location)
1
WQFN−10
CASE 488AQ
AWMG
G
AW = Specific Device Code
M
= Date Code
G
= Pb−Free Device
(Note: Microdot may be in either location)
FUNCTION TABLE
IN_
NO_
NC_
0
OFF
ON
1
ON
OFF
ORDERING INFORMATION
Device
Package
Shipping^†
NLAS4717EPFCT1G Microbump−10 3000 /
(Pb−Free) Tape & Reel
NLAS4717EPMTR2G WQFN−10
3000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 5
Publication Order Number:
NLAS4717EP/D