NLAS4685 Datasheet, PDF (1/10 Pages) ON Semiconductor – Ultra-Low Resistance Dual SPDT Analog Switch

NLAS4685
Ultra−Low Resistance
Dual SPDT Analog Switch
The NLAS4685 is an advanced CMOS analog switch fabricated in
Sub−micron silicon gate CMOS technology. The device is a dual
Independent Single Pole Double Throw (SPDT) switch featuring
Ultra−Low R_ON of 0.8 W, for the Normally Closed (NC) switch and
for the Normally Opened switch (NO) at 2.7 V.
The part also features guaranteed Break Before Make switching,
assuring the switches never short the driver.
The NLAS4685 is available in a 2.0 x 1.5 mm bumped die array,
with a 3 x 4 arrangement of solder bumps. The pitch of the solder
bumps is 0.5 mm for easy handling.
Features
• Ultra−Low R_ON, t0.8 W at 2.7 V
• Threshold Adjusted to Function with 1.8 V Control at
V_CC = 2.7−3.3 V
• Single Supply Operation from 1.8−5.5 V
• Tiny 2 x 1.5 mm Bumped Die
• Low Crosstalk, t 81 dB at 100 kHz
• Full 0−V_CC Signal Handling Capability
• High Isolation, −65 dB at 100 kHz
• Low Standby Current, t50 nA
• Low Distortion, t0.14% THD
• R_ON Flatness of 0.15 W
• Pin for Pin Replacement for MAX4685
• Pb−Free Package is Available
Applications
• Cell Phone
• Speaker Switching
• Power Switching (Up to 100 mA)
• Modems
• Automotive
http://onsemi.com
MARKING
DIAGRAM
A1
Microbump−10
CASE 489AA
XX_D
A1
XX = Device Code
D = Date Code
PIN CONNECTIONS AND LOGIC DIAGRAM
(Top View)
GND
B₁
NC1 C₁
A₁ NC2
IN1 C₂
A₂ IN2
COM1 ^C3
A_{3 COM2}
NO1 C₄
B₄
V_CC
FUNCTION TABLE
IN 1, 2 NO 1, 2
0
OFF
1
ON
A₄ NO2
NC 1, 2
ON
OFF
ORDERING INFORMATION
Device
Package
Shipping^†
NLAS4685FCT1 Microbump 3000 Tape/Reel
NLAS4685FCT1G Microbump 3000 Tape/Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2005
1
August, 2005 − Rev. 2
Publication Order Number:
NLAS4685/D