NLAS4051 Datasheet, PDF (1/11 Pages) ON Semiconductor – Analog Multiplexer/ Demultiplexer

NLAS4051
Analog Multiplexer/
Demultiplexer
TTL Compatible, Single−Pole, 8−Position
Plus Common Off
The NLAS4051 is an improved version of the MC14051 and
MC74HC4051 fabricated in sub−micron Silicon Gate CMOS
technology for lower R_DS(on) resistance and improved linearity with
low current. This device may be operated either with a single supply or
dual supply up to ±3.0 V to pass a 6.0 V_PP signal without coupling
capacitors.
When operating in single supply mode, it is only necessary to tie
V_EE, pin 7 to ground. For dual supply operation, V_EE is tied to a
negative voltage, not to exceed maximum ratings.
Features
• Improved R_DS(on) Specifications
• Pin for Pin Replacement for MAX4051 and MAX4051A
♦ One Half the Resistance Operating at 5.0 V
• Single or Dual Supply Operation
♦ Single 2.5−5.0 V Operation, or Dual ±3.0 V Operation
♦ With V_CC of 3.0 to 3.3 V, Device Can Interface with 1.8 V
Logic, No Translators Needed
♦ Address and Inhibit Logic are Over−Voltage Tolerant and May
Be Driven Up +6.0 V Regardless of V_CC
• Improved Linearity Over Standard HC4051 Devices
• Popular SOIC, and Space Saving TSSOP, and QSOP 16 Pin
Packages
• Pb−Free Packages are Available*
V_CC NO₂ NO₄ NO₀ NO₆ ADD_C ADD_B ADD_A
16 15 14 13 12 11 10 9
1
NO₁
2
3
4
5
6
7
8
NO₃ COM NO₇ NO₅ Inhibit V_EE GND
Figure 1. Pin Connection
(Top View)
http://onsemi.com
MARKING
DIAGRAMS
16
SOIC−16
NLAS4051G
D SUFFIX
AWLYWW
CASE 751B
1
1
16
TSSOP−16
DT SUFFIX
CASE 948F
1
NLAS
4051
ALYWG
G
1
16
QSOP−16
QS SUFFIX
CASE 492
1
S4051
ALYW
1
A
= Assembly Location
WL, L = Wafer Lot
Y
= Year
WW, W = Work Week
G or G = Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping^†
NLAS4051DR2
SOIC−16 2500/Tape & Reel
NLAS4051DR2G SOIC−16 2500/Tape & Reel
(Pb−Free)
NLAS4051DTR2 TSSOP−16 2500/Tape & Reel
NLAS4051DTR2G TSSOP−16 2500/Tape & Reel
(Pb−Free)
NLAS4051QSR QSOP−16 2500/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
May, 2006 − Rev. 3
Publication Order Number:
NLAS4051/D