700 Datasheet, PDF (1/2 Pages) Microsemi Corporation – RECTIFIERS ASSEMBLIES THREE PHASE BRIDGES, 2.5 AMP, STANDARD AND FAST RECOVERY

Tflex^™ 700 Series
Thermal Gap Filler
HIGHEST THERMAL CONDUCTIVITY COMPLIANT GAP FILLER
Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal
performance and high compliancy. The soft interface pad conforms to component topography,
resulting in little or no stress on the components and mating chassis or parts.
Unique silicone and ceramic filler technology allows a combination of high compliancy and
high thermal performance. Tflex™ 700 is stable from -45ºC thru 200ºC and meets UL 94V0
flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal
performance.
FEATURES AND BENEFITS
• Thermal conductivity 5.0 W/mK
• Highly compliant
• Low thermal resistance even at low
pressure
• Available in thicknesses from 0.020” thru
0.200” (0.5mm thru 5.0mm)
• Naturally tacky for adhesion during
assembly and transport
APPLICATIONS
• Cooling components to chassis, frame
or other mating components
• Mass storage devices
• Heat pipe thermal solutions for notebook
computers
• Automotive engine control
• Telecommunication hardware
• LED solid state lighting
• Power electronics
• Flat panel displays
• Audio and video components
• Computer servers and other IT infrastructure
• GPS navigation and other portable devices
Americas: +1.800.843.4556
Europe: +49.8031.24600
Asia: +86.755.2714.116
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