IC-NZ Datasheet, PDF (4/20 Pages) IC-Haus GmbH – FAIL-SAFE LASER DIODE DRIVER

iC-NZ
FAIL-SAFE LASER DIODE DRIVER
ABSOLUTE MAXIMUM RATINGS
Beyond these values damage may occur; device operation is not guaranteed.
Item Symbol Parameter
No.
Conditions
G001 VDD
Supply Voltage VDD Current
G002 I(VDD) Current in VDD
G003 I(CIx)
Current in CIx
V(LDA) = 0
G004 I(NSF) Current in NSF
G005 I(SMD) Current in SMD
G006 I(NERR) Current in NERR
G007 I(MDL) Current in MDL
G008 I(RMDx) Current in RMDx
G009 I()dig
Current in LENL, LENM, LENH,
REGEN, NEN, ENCAL
G010 I(LDKx) Current in LDKx
G011 I(LDA)
Current in LDA
G012 I(RSI)
Current in RSI
G013 I(SDIS) Current in SDIS
G014 I(VREF) Current in VREF
G015 V()c
Voltage at RMDH, RVDD, RMDM, NSF,
MDL, ENCAL, SMD, VREF, REGEN,
CIx, LENx, NERR, LDA, RSI, SDIS
G016 V()h
Voltage at LDKx
G017 Vd()
ESD Susceptibility at all pins
HBM, 100 pF discharged through 1.5 kΩ
G018 Tj
Operating Junction Temperature
G019 Ts
Storage Temperature Range
Rev B2, Page 4/20
Min.
-0.7
-0.7
Unit
Max.
6
V
400
mA
5
mA
20
mA
20
mA
20
mA
20
mA
20
mA
20
mA
300
mA
400
mA
20
mA
20
mA
50
mA
6
V
-0.7
15
V
2
kV
-40
150
°C
-40
150
°C
THERMAL DATA
Operating Conditions: VDD = 3.5...5.5 V
Item Symbol Parameter
No.
Conditions
Unit
Min. Typ. Max.
T01 Ta
Operating Ambient Temperature Range
(extended range on request)
-20
90 °C
T02 Rthja
Thermal Resistance Chip/Ambient
surface mounted, thermal pad soldered to ca.
2 cm² heat sink
30 40 K/W
All voltages are referenced to ground unless otherwise stated.
All currents into the device pins are positive; all currents out of the device pins are negative.