LB-SA-3505 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermally Conductive,Two-Part,Liquid Silicone Adhesive

Liqui-Bond^® SA 3505 (Two-Part)
January 2014
PRODUCT DESCRIPTION
Thermally Conductive,Two-Part,
Liquid Silicone Adhesive
FEATURES AND BENEFITS
• Thermal Conductivity: 3.5 W/m-K
• Eliminates need for mechanical fasteners
• Room Temperature Storage
• Maintains structural bond in severe
environment applications
• Heat cure
Liqui-Bond^® SA 3505 is a high performance,
thermally conductive, liquid adhesive. This
material is supplied as a two-part material
and requires no refrigeration.
The mixed material cures at
elevated temperatures. As cured,
Liqui-Bond^® SA 3505 provides a strong
bonding, form-in-place elastomer. The
material’s mild elastic properties assist
in relieving CTE stresses during
thermal cycling.
Liquid dispensed thermal materials offer
infinite thickness variations and impart little
to no stress on sensitive components
during assembly. Liqui-Bond^® SA 3505 is
available with optional glass spacer beads
to provide a consistent bond line and
ensure dielectric integrity.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF LIQUI-BOND SA 3505
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
Brown
Brown
Visual
Color / Part B
Light Gray
Light Gray
Visual
Viscosity / Part A, High Shear (Pa-s) (1)
45
45
ASTM D5099
Viscosity / Part B, High Shear (Pa-s) (1)
30
30
ASTM D5099
Density (g/cc)
2.9
2.9
ASTM D792
Mix Ratio
1:1
1:1
—
Shelf Life @ 25°C (months)
6
6
—
PROPERTY AS CURED
Color
Light Brown
Light Brown
Visual
Hardness (Shore A) (2)
90
90
ASTM D2240
Continuous Use Temp (°F) / (°C)
-76 to 392
-60 to 200
—
Shear Strength (psi) / (MPa)
450
3.15
ASTM D1002
ELECTRICAL AS CURED
Dielectric Strength (V/mil) / (V/mm)
250
10,000
ASTM D149
Dielectric Constant (1000 Hz)
6.9
6.9
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁰
10¹⁰
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
3.5
3.5
ASTM D5470
CURE SCHEDULE
Pot Life @ 25°C (3)
240 min (4 hr) 240 min (4 hr)
—
Cure @ 125°C (min) (4)
20
20
—
Cure @ 150°C (min) (4)
10
10
—
1) Capillary Viscosity, 600/sec, Part A and B measured separately.
2) Thirty second delay value Shore A hardness scale.
3) Based on ^1/8'' diameter bead.
4) Cure schedule — time after cure temperature is achieved at the interface. Ramp time is application dependent.
TYPICAL APPLICATIONS INCLUDE
• Power supplies
• Discrete component to heat spreader
• PCBA to housing
CONFIGURATIONS AVAILABLE
• Supplied in cartridge or kit form
PDS_LB_SA 3505_January 2014