LB-EA-1805 Datasheet, PDF (1/2 Pages) List of Unclassifed Manufacturers – Thermally Conductive, Two-Part,Liquid Epoxy Adhesive

Liqui-Bond^® EA 1805 (Two-Part)
September 2014
PRODUCT DESCRIPTION
Thermally Conductive, Two-Part,
Liquid Epoxy Adhesive
FEATURES AND BENEFITS
• Room temperature cure
• Room temperature storage
• Thermal Conductivity: 1.8 W/m-K
• Eliminates need for mechanical fasteners
• Maintains structural bond in
severe-environment applications
• Excellent chemical and
mechanical stability
Liqui-Bond^® EA 1805 is a two-component,
epoxy based, liquid-dispensable adhesive.
Liqui-Bond^® EA 1805 has a thermal
conductivity of 1.8 W/mK.
Liqui-Bond^® EA 1805 will be supplied in a
two-component format, and refrigeration is
not required.
Liqui-Bond^® EA 1805 has a high bond
strength with room temperature cure that
can be accelerated with additional heat.
The high bond strength eliminates the
need for fasteners and maintains structural
bond in severe environments.
Recommended usage is filling any surface
irregularities between heat sources and
heat spreaders of similar CTE.
Liqui-Bond^® EA 1805 is thixotropic and will
remain in place during dispensing, and the
material will flow easily under minimal
pressure resulting in thin bondlines and
very low stress placed on fragile
components during assembly.
Note: To build a part number, visit our
website at www.bergquistcompany.com.
TYPICAL PROPERTIES OF LIQUI-BOND EA 1805
PROPERTY
IMPERIAL VALUE METRIC VALUE TEST METHOD
Color / Part A
Gray
Gray
Visual
Color / Part B
Pale Yellow
Pale Yellow
Visual
Viscosity / Part A, High Shear (Pa-s) (1)
60
60
ASTM D2196
Viscosity / Part B, High Shear (Pa-s) (1)
62
62
ASTM D2196
Density (g/cc)
2.7
2.7
ASTM D792
Mix Ratio By Volume
1:1
1:1
—
Shelf Life @ 25°C (months)
6
6
—
PROPERTY AS CURED
Hardness (Shore D) (2)
90
90
ASTM D2240
Continuous Use Temp (°F) / (°C)
- 40 to 257
- 40 to 125
—
Shear Strength (psi) / (MPa) (3)
450
3.1
ASTM D1002
ELECTRICAL AS CURED
Dielectric Strength (V/mil) / (V/mm)
250
10,000
ASTM D149
Dielectric Constant (1000 Hz)
7.5
7.5
ASTM D150
Volume Resistivity (Ohm-meter)
10¹⁴
10¹⁴
ASTM D257
Flame Rating
V-O
V-O
U.L. 94
THERMAL AS CURED
Thermal Conductivity (W/m-K)
1.8
1.8
ASTM D5470
CURE SCHEDULE
Cure @ 25°C (hours)
10
10
—
Cure @ 125°C (min) (4)
10
10
—
1) Capillary Viscosity, 200/sec, Part A and B measured separately.
2) Thirty second delay value Shore D hardness scale.
3) Al to Al, cured at room temperature
4) 90% cure cycle - time after cure temperature is achieved at the interface. Ramp time is application dependent.
TYPICAL APPLICATIONS INCLUDE
• LED lighting
• Power supplies
• Discrete component to heat spreader
• Automotive lighting
• White goods
CONFIGURATIONS AVAILABLE
• Supplied in cartridge or kit form
PDS_LB_EA 1805_September 2014