SX16A-12SA Datasheet, PDF (1/3 Pages) Bourns Electronic Solutions – SIP Non-Isolated Power Module

*RoHS ^COMPLIANT
Features
■ SIP (Single in-line package)
■ Output voltage programmable from
0.75 Vdc to 5.5 Vdc via external resistor
■ 16 A output current
■ Up to 94 % efficiency
■ Small size, low profile
■ Cost-efficient
■ Low output ripple and noise
■ High reliability
■ Remote on/off
■ Output overcurrent protection
(non-latching)
■ Optional sequencing function
SX(T)16A-12SA SIP Non-Isolated Power Module
Description
Bourns^® SX(T)16A-12SA is a non-isolated DC-DC converter offering designers a cost and space-efficient solution with standard
features such as remote on/off, precisely regulated programmable output voltage and overcurrent protection and optional output
voltage sequencing.
Specifications
Parameter
INPUT
Voltage
Current
Remote: ON/OFF
Low or Open =
High =
Standard
On
Off
-P option
Off
On
OUTPUT
Voltage Adjustment Range
Current
Voltage Setpoint Accuracy
Line Regulation
Load Regulation
Temperature Regulation
Ripple (pk-pk) (20 MHz Bandwidth)
Ripple (rms)
Dynamic Load Response:
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
50 % to 100 % Load or 100 % to 50 % Load;
(∆i/∆t = 2.5 A/µs; 25 °C)
GENERAL
MTBF
Operating Temperature
Storage Temperature
Switching Frequency
Efficiency
(Vin = 12 Vdc, TA= 25 °C, Full Load)
Min. Nom. Max.
8.3
12
14
10.0
Units
Vdc
Adc
Notes
0.4
Vdc
2.4
Vin
Vdc
10 µA max.
1 mA max.
0.75
5.5
Vdc
0.0
16.0
Adc
-2.0
2.0
% Vo, _set
0.3
% Vo, _set
0.4
% Vo, _set
0.4
% Vo, _set
0 to +85 °C
30
75
mVpk-pk 1 µF ceramic//10 µF tantalum capacitors
12
30
mVrms 1 µF ceramic//10 µF tantalum capacitors
200
mV
1 µF ceramic//10 µF tantalum capacitors
25
µs
100
50
mV
µs
2 x 150 µF polymer capacitors
10,000
-40
+85
-55
+125
300
85.0
87.0
88.0
90.5
92.0
94.0
kHrs
°C
°C
kHz
%
%
%
%
%
%
Vo,set = 1.2 Vdc
Vo,set = 1.5 Vdc
Vo,set = 1.8 Vdc
Vo,set = 2.5 Vdc
Vo,set = 3.3 Vdc
Vo,set = 5.0 Vdc
Applications
■ Intermediate Bus architecture
■ Distributed power applications
■ Workstations and servers
■ Telecom equipment
■ Enterprise networks including LANs/WANs
■ Latest generation ICs (DSP, FPGA, ASIC) and microprocessor powered applications
*RoHS Directive 2002/95/EC Jan 27 2003 including Annex.
Specifications are subject to change without notice.
Customers should verify device performance in their specific applications.