UMB05F Datasheet, PDF (1/2 Pages) Guangdong Juxing Electronics Technology Co., Ltd. – Ultra Miniature Glass Passivated Single-Phase

Z ibo Seno Electronic Engineering Co., Ltd.
UMB05F – UMB10F
1.0A ULTRA FAST SURFACE MOUNT GLASS PASSIVATED BRIDGE RECTIFIER
Features
! Glass Passivated Die Construction
! Low Forward Voltage Drop
! High Current Capability
! High Surge Current Capability
! Designed for Surface Mount Application
! Plastic Material – UL Flammability 94V-O
-
B
+
H
~
~
G
DE





















































A
Mechanical Data
J
! Case: MB-F, Molded Plastic
! Terminals: Plated Leads Solderable per
K
MIL-STD-202, Method 208
! Polarity: As Marked on Case
! Weight: 0.134 grams (approx.)
! Mounting Position: Any
! Marking: Type Number
! Lead Free: For RoHS / Lead Free Version
MB-F
Dim
Min
Max
A
4.50
4.95
B
3.60
4.10
C
0.15
0.35
D
—
0.20
E
6.40
7.00
G
0.50
1.10
H
1.30
1.70
J
1.20
1.60
K
2.30
2.70
L
—
1.80
All Dimensions in mm
Maximum Ratings and Electrical Characteristics @T_A=25°C unless otherwise specified
Single Phase, half wave, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
UMB
05F
UMB UMB
1F 2F
UMB
4F
UMB UMB
6F 8F
UMB
10F
Unit
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
VR
50 100 200 400 600 800 1000 V
RMS Reverse Voltage
VR(RMS)
35 70 140 280 420 560 700
V
Average Rectified Output Current (Note 1) @T_A = 40°C
Average Rectified Output Current (Note 2) @T_A = 40°C
IO
Non-Repetitive Peak Forward Surge Current 8.3ms
Single half sine-wave superimposed on rated load
IFSM
(JEDEC Method)
I²t Rating for Fusing (t < 8.3ms)
I²t
1.0
A
35
A
5.0
A²s
Forward Voltage per element
@I_F = 1.0A
VFM
Peak Reverse Current
At Rated DC Blocking Voltage
@T_A = 25°C
@T_A = 125°C
IRM
Reverse Recovery Time (Note 4)
trr
Typical Junction Capacitance per leg (Note 3)
Cj
1.0
1.3
1.7
V
5.0
500
µA
50
75
nS
13
pF
Typical Thermal Resistance per leg (Note 1)
R
JA
R
JL
62.5
25
°C/W
Operating and Storage Temperature Range
Tj, TSTG
-55 to +150
°C
Note: 1. Mounted on glass epoxy PC board with 1.3mm² solder pad.
2. Mounted on aluminum substrate PC board with 1.3mm² solder pad.
3. Measured at 1.0 MHz and applied reverse voltage of 4.0V D.C.
4. Measured with IF = 0.5A, IR = 1.0A, IRR = 0.25A. See figure 5.
UMB05F - UMB10F
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