GBJ20005 Datasheet, PDF (1/2 Pages) Diodes Incorporated – 20A GLASS PASSIVATED BRIDGE RECTIFIER

Z ibo Seno Electronic Engineering Co., Ltd.
GBJ20005 - GBJ2010
Features
· Glass Passivated Die Construction
· High Case Dielectric Strength of 1500VRMS
· Low Reverse Leakage Current
· Surge Overload Rating to 350A Peak
· Ideal for Printed Circuit Board Applications
· Plastic Material - UL Flammability
Classification 94V-0
· Lead Free: :For RoHS / Lead Free Version
Mechanical Data
· Case: Molded Plastic
· Terminals: Plated Leads, Solderable per
MIL-STD-202, Method 208
· Polarity: Molded on Body
· Mounting: Through Hole for #6 Screw
· Mounting Torque: 5.0 in-lbs Maximum
· Weight: 6.6 grams (approx)
· Marking: Type Number
20A GLASS PASSIVATED BRIDGE RECTIFIER
GBJ6
Dim Min Max
A 29.70 30.30
B 19.70 20.30
K
A
L
C 17.00 18.00
M
D
3.80 4.20
E
7.30 7.70
G
9.80 10.20
B
_
S
N
H
2.00 2.40
I
0.90 1.10
J
H
D
C
P
J
2.30 2.70
K
3.0 X 45°
I
R
L
4.40 4.80
M
3.40 3.80
G EE
N
3.10 3.40
P
2.50 2.90
R
0.60 0.80
S 10.80 11.20
All Dimensions in mm
Maximum Ratings and Electrical Characteristics ^{@ TA = 25°C unless otherwise specified}
Single phase, 60Hz, resistive or inductive load.
For capacitive load, derate current by 20%.
Characteristic
Symbol
GBJ
20005
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage
VRRM
VRWM
50
V_R
RMS Reverse Voltage
V_R(RMS) 35
Average Forward Rectified Output Current @ TC = 110°C I_O
Non-Repetitive Peak Forward Surge Current, 8.3 ms single
half-sine-wave superimposed on rated load
IFSM
Forward Voltage per element
@ I_F = 10A V_FM
Peak Reverse Current
at Rated DC Blocking Voltage
@ T_A = 25°C
@ T_C = 125°C
I_R
I²t Rating for Fusing (t < 8.3 ms) (Note 1)
I²t
Typical Total Capacitance per Element (Note 2)
C_T
Typical Thermal Resistance Junction to Case (Note 3)
R_qJC
Operating and Storage Temperature Range
T_j, T_STG
GBJ
2001
100
70
GBJ GBJ GBJ
2002 2004 2006
200 400 600
140 280 420
20
240
1.05
10
500
240
60
0.8
-55 to +150
GBJ
2008
800
560
GBJ
2010
Unit
1000 V
700 V
A
A
V
µA
A²s
pF
°C/W
°C
Notes:
1. Non-repetitive, for t > 1ms and < 8.3 ms.
2. Measured at 1.0 MHz and applied reverse voltage of 4.0V DC.
3. Unit mounted on 300 x 300 x 1.6mm Cu plate heat sink.
4. RoHS revision 13.2.2003. Glass and High Temperature Solder Exemptions Applied, see EU Directive Annex Notes 5 and 7.
GBJ20005 - GBJ2010
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