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CJPF02N60 Datasheet, PDF (1/3 Pages) ZP Semiconductor – Plastic-Encapsulate MOSFETS
CJPF02N60
TO-220F Plastic-Encapsulate MOSFETS
CJPF02N60 N-Channel Power MOSFET
TO-220F
General Description
The high voltage MOSFET uses an advanced termination scheme
to provide enhanced voltage-blocking capability without degrading 1. GATE
performance over time. In addition , this advanced MOSFET is designed
2. DRAIN
3. SOURCE
to withstand high energy in avalanche and commutation modes . The
123
new energy efficient design also offers a drain-to-source diode with a
fast recovery time. Designed for high voltage, high speed switching
applications in power suppliers, converters and PWM motor controls ,
these devices are particularly well suited for bridge circuits where diode
speed and commutating safe operating areas are critical and offer
additional and safety margin against unexpected voltage transients.
FEATURES
z Robust High Voltage Termination
z Avalanche Energy Specified
z Source-to-Drain Diode Recovery Time Comparable to a Discrete Fast Recovery Diode
z Diode is Characterized for Use in Bridge Circuits
z IDSS and VDS(on) Specified at Elevated Temperature
Maximum ratings (Ta=25℃ unless otherwise noted)
Parameter
Symbol
Drain-Source Voltage
VDS
Gate-Source Voltage
VGS
Continuous Drain Current
ID
Pulsed Drain Current
IDM
Power Dissipation
PD
Single Pulsed Avalanche Energy
EAS*
Thermal Resistance from Junction to Ambient
RθJA
Junction Temperature
TJ
Storage Temperature
TSTG
*EAS condition: Tj=25℃,VDD=50V,L=64mH,IL=2A,RG=25Ω
Value
600
±20
2
9
2
128
62.5
150
-55 ~+150
sales@zpsemi.com
www.zpsemi.com
Unit
V
A
W
mJ
℃/W
℃
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