MMDL914T1 Datasheet, PDF (1/2 Pages) Zowie Technology Corporation – SURFACE MOUNT HIGH-SPEED SWITCHING DIODE

MMDL914T1
SURFACE MOUNT HIGH-SPEED SWITCHING DIODE
Reverse Breakdown Voltage - 100 Volts
Peak Forward Current - 200mA
SOD-323
0.016(0.40)
0.010(0.25)
0.106(2.70)
0.091(2.30)
0.071(1.80)
0.063(1.60)
1
2
0.053(1.35)
0.045(1.15)
NOTE 3
0.007(0.18)
0.004(0.09)
0.004(0.10)
0.000(0.00)
0.006(0.150)
REF.
0.039(1.00)
0.031(0.80)
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS SPECIFIED PER L/F DRAWING WITH SOLDER PLATING.
1
1
CATHODE
2
2
ANODE
0.025(0.63)
0.063(1.60)
0.112(2.85)
0.033(0.83)
*Dimensions in inches and (millimeters)
Device Marking : MMDL6050T1 = 5A
MAXIMUM RATINGS
Ratings at 25 ^oC ambient temperature unless otherwise specified.
SYMBOLS
Continuous Reverse Voltage
VR
Peak Forward Current
IF
Peak Forward Surge Current
IFSM
VALUE
100
200
500
THERMAL CHARACTERISTICS
CHARACTERISTIC
SYMBOLS
MAX.
Total Device Dissipation FR-5 Board, TA=25^oC
Derate above 25^oC
200
PD
1.57
Thermal Resistance Junction to Ambient
R JA
635
Junction and Storage Temperature
TJ, TSTG
150
o
ELECTRICAL CHARACTERISTICS ( TA=25 C unless otherwise noted )
CHARACTERISTIC
SYMBOLS
MIN.
MAX.
Reverse Breakdown Voltage
Reverse Voltage Leakage Current
( IBR=100uA )
( VR=20Vdc )
( VR=75Vdc )
V( BR )
100
-
-
25
IR
-
5.0
Forward Voltage
( IF=10mAdc )
VF
-
1.0
Junction Capacitance
Reverse Recovery Time
( VR=0V , f = 1.0MHz )
CJ
-
4.0
( IF=IR=10mAdc, IR(REC) = 1.0mAdc
trr
-
4.0
UNITS
Vdc
mAdc
mAdc
UNITS
mW
mW / ^oC
o_{C / W}
o_C
UNITS
Vdc
nAdc
uAdc
Vdc
pF
nS
REV. : 0
Zowie Technology Corporation