LX10M Datasheet, PDF (1/2 Pages) Zowie Technology Corporation – Lux-Bridge

ZOWIE
Lux-Bridge
LX10M
OUTLINE DIMENSIONS
FEATURES
Case : MBCN
* Halogen-free type
* Glass passivated chip junctions
* Compliance to RoHS product
3.50 ± 0.10
* Leadless chip form, no lead damage
2.54 ± 0.10
* Low power loss, High efficiency
* High current capability
* Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
t _APPLICATION
c _{* Lighting}
u ^{* AC/DC Power Supply}
* Communication Equipment
rod MECHANICAL DATA
Case : Packed with FRP substrate and epoxy underfilled
p _{Terminals : Pure Tin plated (Lead-Free),}
solderable per MIL-STD-750, Method 2026.
New ^PACKING
~
~
0.70 ± 0.10
MARKING
* 5,000 pieces per 13" (330mm ± 2mm) reel
* 2 reels per box
* 5 boxes per carton
4
1
3
2
1.15 ± 0.20
M
~
~
(1000V / 1A)
Unit : mm
Mounting Pad Layout
2.54
REF.
0.480
MIN.
Absolute Maximum Ratings (Ta = 25 ^oC)
ITEM
Repetitive peak reverse voltage
Average forward current
Peak forward surge current
Operating junction and storage temperature Range
Symbol
Conditions
VRRM
IF(AV)
IFSM 8.3ms single half sine-wave
Tj,TSTG
Rating
1000
1.0
30
-55 to +150
Unit
V
A
A
o_C
Electrical characteristics (Ta = 25 ^oC)
ITEM
Symbol
Conditions
Forward voltage
Repetitive peak reverse current
Current squared time
VF
IRRM
I²t
@IF = 0.4A
@IF = 1.0A
VR = Max. VRRM
Ta = 25 ^oC
Ta = 125 ^oC
t < 8.3ms , Ta = 25 ^oC
Junction capacitance
Cj
VR = 4V, f = 1.0 MHz
Typical thermal resistance per leg
Rth(JA) Junction to ambient (Note 1)
Rth(JC) Junction to case (Note 1)
NOTES: (1) On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3 x 1.3 mm) solder pads.
(2) Preliminary specification.
Min.
-
-
-
-
-
-
-
-
Typ.
0.90
-
0.08
-
3.74
9
130
40
Max.
1.0
1.1
5
100
-
-
-
-
Unit
V
uA
A²s
pF
o_C/W
o_C/W
REV. 2
2014/07