LX08M Datasheet, PDF (1/2 Pages) Zowie Technology Corporation – Lux-Bridge

ZOWIE
LX08M
FEATURES
* Halogen-free type
* Glass passivated chip junctions
* Compliance to RoHS product
* Leadless chip form, no lead damage
* Low power loss, High efficiency
* High current capability
* Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
APPLICATION
* Lighting
* AC/DC Power Supply
* Communication Equipment
Lux-Bridge
OUTLINE DIMENSIONS
Case : MBCN
3.50 ± 0.10
2.54 ± 0.10
Unit : mm
4
1
~
~
0.70 ± 0.10
3
2
1.15 ± 0.20
MECHANICAL DATA
Case : Packed with FRP substrate and epoxy underfilled
Terminals : Pure Tin plated (Lead-Free),
solderable per MIL-STD-750, Method 2026.
MARKING
PACKING
* 5,000 pieces per 13" (330mm ± 2mm) reel
* 2 reels per box
* 5 boxes per carton
M
~
~
Absolute Maximum Ratings (Ta = 25 ^oC)
ITEM
Repetitive peak reverse voltage
Average forward output rectified current (Fig.1)
Peak forward surge current
Operating junction and storage temperature Range
Symbol
Conditions
VRRM
IF(AV)
IFSM
on glass-epoxy P.C.B. (Note 1)
on aluminum substrate (Note 2)
8.3ms single half sine-wave
Tj,TSTG
Rating
1000
0.5
0.8
30
-55 to +150
Unit
V
A
A
o_C
Electrical characteristics (Ta = 25 ^oC)
ITEM
Symbol
Conditions
Min. Typ. Max. Unit
Forward voltage
VF
IF = 0.4A
-
0.90
1.0
V
Repetitive peak reverse current
Ta = 25 ^oC
-
IRRM
VR = Max. VRRM
Ta = 125 ^oC
-
Current squared time
I²t
t < 8.3ms , Ta = 25 ^oC
-
Typical thermal resistance per leg
Rth(JA) Junction to ambient (Note 1)
-
Rth(JC) Junction to case (Note 1)
-
NOTES: (1) On glass epoxy P.C.B. mounted on 0.05" x 0.05" (1.3 x 1.3 mm) solder pads.
(2) On aluminum substrate P.C.B. with an area of 0.8 x 0.8" (20 x 20 mm) mounted on 0.05" x 0.05" (1.3 x 13. mm) solder pads.
0.08
-
3.74
130
40
5
uA
100
-
A²s
-
o_C/W
-
o_C/W
REV. 1
2014/03