MDS764 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package TSOP (ll) 44

Based on JEDEC: JEP95 MO-133
1 Dimensions
ZMD-Standard
Package TSOP (ll) 44
(400 mil)
Dimensions in millimetres
44
September 2002
MDS
764
Detail Z
L_P
1
e
bp
D
0,1 M
Dimensions of Sub-Group B1
A_max
b_Pmin
b_Pmax
e_nom
H_Emin
H_Emax
L_Pmin
1,20
0,30
0,45
0,80
11,56
11,96
0,40
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
£ 0,3 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
A₂
A
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min*
D_max*
E_min*
E_max*
q_min
q_max
-
0,05
0,15
0,95
1,05
0,12
0,21
18,28
18,54
10,03
10,29
0°
5°
* without mold-flash
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Check: signed Marx
Date: 18.09.2002
Quality: signed Kochan
Doc-No.
QS-000764-HD-01