MDS761 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package SSOP14

Based on JEDEC JEP95: MO-150
1 Dimensions
X
14
ZMD-Standard
Package SSOP14
(5,3 mm)
Dimensions in millimetres
July 2000
MDS
761
View X
k x 45
0,1
L_P
1
Z
e
b_{p 0,15 M}
D
Dimensions of Sub-Group B1
A_max
b_Pmin
b_Pmax
e_nom
H_Emin
H_Emax
L_Pmin
Z_max
1,99
0,25
0,38
0,65
7,65
7,90
0,63
1,22
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
 0,3 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Zentrum Mikroelektronik Dresden
Editor:
Check:
Date:
Quality:
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min*
D_max*
E_min*
E_max*
k_min
°_min
°_max
1,73
0,05
0,21
1,68
1,78
0,09
0,20
6,07
6,33
5,20
5,38
0,25
0
10
* without mold-flash
Doc-No.
QS-000761-HD-01