MDS755 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package PQFP64

Based on JEDEC JEP95: MO-143
1 Dimensions
ZMD-Standard
Package PQFP64
(10x10)
Dimensions in millimetres
Z
0,1
November 2003
MDS
755
Supersedes
Edition 12.98
Detail Z
L_P
1
D
H_D
Dimensions of Sub-Group B1
e_nom
A_max
b_Pmin
b_Pmax
H_Emin
H_Emax
H_Dmin
H_Dmax
L_Pmin
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
0.50
2.45
0.15
0.30
12.95
13.45
12.95
13.45
0.73
≤ 0,6 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Zentrum Mikroelektronik Dresden
Editor: signed Schoder
Check: signes Marx
Date: 03. November 2003
Quality: signed Lorenz
Dimensions of Sub-Group C1
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min
D_max
E_min
E_max
θ_min
θ_max
0.10
0.50
1.95
2.10
0.13
0.23
9.90
10.10
9.90
10.10
0°
10°
Doc-No.
QS-000755-HD-02