MDS753 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package SSOP16

Based on JEDEC JEP95: MO-150
1 Dimensions
X
16
ZMD-Standard
Package SSOP16
(5,3 mm)
Dimensions in millimetres
February 2000
MDS
753
Supersedes
Edition 06.98
View X
k x 45°
0,1
L_P
1
Z
e
b_{p 0,15 M}
D
Dimensions of Sub-Group B1
A_max
b_Pmin
b_Pmax
e_nom
H_Emin
H_Emax
L_Pmin
Z_max
1,99
0,25
0,38
0,65
7,65
7,90
0,63
0,89
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
£ 0,3 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Check: signed Marx
Date: 30.03.1998
Quality: signed Lorenz
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min*
D_max*
E_min*
E_max*
k_min
q_min
q_max
1,73
0,05
0,21
1,68
1,78
0,09
0,20
6,07
6,33
5,20
5,38
0,25
0°
10°
* without mold-flash
Doc-No.
QS-000753-HD-02