MDS751 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package TSOP32 (I/8x20)

Based on JEDEC: JEP95 MO-142
1 Dimensions
ZMD-Standard
Package TSOP32 (I/8x20)
(Normal Option)
Dimensions in millimetres
Z
0,1
December 2004
MDS
751
Detail Z
L_P
D
H_D
Dimensions of Sub-Group B1
A_max
b_Pmin
b_Pmax
e_nom
H_Dmin
H_Dmax
L_Pmin
1,20
0,17
0,27
0,50
19,80
20,20
0,40
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
≤ 0,3 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min*
D_max*
E_min*
E_max*
θ_min
θ_max
-
0,05
0,15
0,90
1,05
0,10
0,21
18,30
18,50
7,80
8,20
0°
5°
* without mold-flash
Zentrum Mikroelektronik Dresden
Editor: signature by Schoder
Check: signature by Marx
Date: 07.12.2004
Quality: signature by Tina Kochan
Doc-No.
QS-000751-HD-02