MDS750 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package PQ4-LQFP44

ZMD-Standard
Package PQ4-LQFP44
(10 x 10)
Based on JEDEC: MS-026
1 Dimensions
Dimensions in millimetres
Detail Z
Z
April 2002
MDS
750
Supersedes
Edition 11.97
0,1
top view
L_P
bottom view
1
D
H_D
Dimensions of Sub-Group B1
e_nom
A_max
b_Pmin
b_Pmax
H_Emin
H_Emax
H_Dmin
H_Dmax
L_Pmin
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
0,80
1,60
0,30
0,45
11,85
12,15
11,85
12,15
0,45
£ 0,5 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Check: signed Marx
Date: 30.04.2002
Quality: signed Gersdorf
Heat sink
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min
D_max
E_min
E_max
q_min
q_max
-
0,05
0,15
1,35
1,45
0,09
0,20
9,75
10,25
9,75
10,25
0°
7°
Doc-No.
QS-000750-HD-02