MDS745 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package SOP32

Based on JEDEC: JEP95 MO-119
1 Dimensions
X
32
ZMD-Standard
Package SOP32
(300 mil)
Dimensions in millimetres
March 1997
1. Amendment November 1997
MDS
745
View X
k x 45
0,1
L_P
1
Z
e
b_p
0,2 M
D
Dimensions of Sub-Group B1
A_max
b_Pmin
b_Pmax
e_nom
H_Emin
H_Emax
L_Pmin
Z_max
2,54
0,36
0,51
1,27
10,29
10,64
0,53
0,91
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
 0,91 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Zentrum Mikroelektronik Dresden
Editor: signed Schoder
Check: signed Marx
Date: 27.03.1997
Quality: signed Lorenz
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min*
D_max*
E_min*
E_max*
k_min
°_min
°_max
2,29
0,102
0,254
2,18
2,29
0,15
0,32
20,57
20,88
7,42
7,60
0,25
0
8
* without mold-flash
Doc-No.
QS-000745-HD-01