MDS739 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package SOP24

Based on IEC 191-2Q: Type 075E05 B
1 Dimensions
X
24
ZMD-Standard
Package SOP24
(300 mil)
Maße in mm
0,1
November 1995
MDS
739
Supersedes
View X
k x 45
L_P
1
Z
e
b
0,2 M
D
Dimensions of Sub-Group B1
A_max
b_Pmin
b_Pmax
e_nom
H_Emin
H_Emax
L_Pmin
Z_max
2,65
0,35
0,49
1,27
10,00
10,65
0,40
0,82
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
 0,7 g
Low stress epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min*
D_max*
E_min*
E_max*
k_min
°_min
°_max
2,45
0,10
0,30
2,25
2,45
0,23
0,32
15,20
15,60
7,40
7,60
0,25
0
8
* without mold-flash
Zentrum Mikroelektronik Dresden GmbH
Editor: signed Schoder
Check: signed Wilde
Date: 13.11.1995
Quality: signed Lorenz
Doc-No.
QS-000739-HD-02
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Proprietary data, company confidential. All rights reserved.