MDS726 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package SOP8

Based on IEC 191-2Q: Type 076E35 B
1 Dimensions
X
ZMD-Standard
Package SOP8
(150 mil)
Dimensions in millimetres
b
0,1
0,2 M
8
January 2005
MDS
726
Supersedes
Edition 11.95
View X
k x 45°
L_P
1
Z
e
D
Dimensions of Sub-Group B1
A_max
b_Pmin
b_Pmax
e_nom
H_Emin
H_Emax
L_Pmin
Z_max
1,95
0,35
0,49
1,27
5,80
6,30
0,40
0,635
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
≤ 0,3 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
Z-bends
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min*
D_max*
E_min*
E_max*
k_min
θ_min
θ_max
1,55
0,10
0,30
1,40
1,80
0,15
0,25
4,80
5,00
3,80
4,00
0,33
0°
8°
* without mold-flash
Zentrum Mikroelektronik Dresden
Editor: signature by Schoder
Check: signature by Marx
Date: 06.01.2005
Quality: signature by Tina Kochan
Doc-No.
QS-000726-HD-03
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