MDS717 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package PQFP80

Based on JEDEC : MO-112AA-1
1 Dimensions
e
b_P
0,2 M
ZMD-Standard
Package PQFP80
Dimensions in millimetres
Z
November 1995
MDS
717
Supersedes
Edition 11.92
1. Amendment 02.93
0,1
Detail Z
b¹
D
H_D
Dimensions of Sub-Group B1
e_nom
A_max
b_Pmin
b_Pmax
H_Emin
H_Emax
H_Dmin
H_Dmax
L_Pmin
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
0,80
3,20
0,25
0,45
17,60
18,20
23,60
24,20
0,65
£ 1,6 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
z-bends
Zentrum Mikroelektronik Dresden GmbH
Editor:
Check:
Date:
Quality:
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L_P
Dimensions of Sub-Group C1
A_min
A_1min
A_1max
A_2min
A_2max
c_min
c_max
D_min
D_max
E_min
E_max
q_min
q_max
b
2,75
0,15
0,38
2,60
2,80
0,12
0,25
19,90
20,10
13,90
14,10
0°
10°
45°
Doc-No.
QS-000717-HD-02
Proprietary data, company confidential. All rights reserved.