MDS709 Datasheet, PDF (1/1 Pages) Zentrum Mikroelektronik Dresden AG – Package PLCC68

Based on IEC 191-2Q: Type 112E12
1 Dimensions
ZMD-Standard
Package PLCC68
Dimensions in millimetres
e
b_P
e1
0,2 _M
November 1995
MDS
709
Supersedes
Edition 04.92
3. Amendment 02.93
0,1
68
1
>
k
D
H_D
Dimensions of Sub-Group B1
A_max
b_Pmin
b_Pmax
e_nom
H_Dmin
H_Dmax
H_Emin
H_Emax
5,10
0,33
0,53
1,27
25,00
25,27
25,00
25,27
2 Weight
3 Package Body Material
4 Lead Material
5 Lead Finish
6 Lead Form
£ 4,8 g
Low Stress Epoxy
FeNi-Alloy or Cu-Alloy
solder plating
J-bends
Dimensions of Sub-Group C1
A_min
A_2min
A_2max
D_min
D_max
E_min
E_max
k_min
b
e_1min
e_1max
4,19
3,10
3,91
24,10
24,33
24,10
24,33
1,00
45°
22,60
23,62
Zentrum Mikroelektronik Dresden AG
Editor: signed Schoder
Check: signed Wilde
Date 13.11.1995
Quality signed Lorenz:
Doc-No.
QS-000709-HD-02
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