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ZXMN7A11K Datasheet, PDF (4/8 Pages) Zetex Semiconductors – 70V N-channel enhancement mode MOSFET | |||
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ZXMN7A11K
Electrical characteristics (at Tamb = 25°C unless otherwise stated)
Parameter
Symbol
Static
Drain-source breakdown
voltage
V(BR)DSS
Zero gate voltage drain current IDSS
Gate-body leakage
IGSS
Gate-source threshold voltage VGS(th)
Static drain-source on-state
resistance (*)
RDS(on)
Min.
70
1.0
Forward transconductance(*)(â¡) gfs
Dynamic(â¡)
Input capacitance
Ciss
Output capacitance
Coss
Reverse transfer capacitance Crss
Switching (â ) (â¡)
Turn-on-delay time
td(on)
Rise time
tr
Turn-off delay time
td(off)
Fall time
tf
Total gate charge
Qg
Total gate charge
Qg
Gate-source charge
Qgs
Gate drain charge
Qgd
Source-drain diode
Diode forward voltage(*)
VSD
Reverse recovery time (â¡)
trr
Reverse recovery charge(â¡)
Qrr
Typ.
4.66
298
35
21
1.9
2
11.5
5.8
4.35
7.4
1.06
1.8
0.85
19.8
14
Max.
1
100
0.13
0.19
0.95
Unit Conditions
V ID= 250â®A, VGS=0V
â®A VDS= 70V, VGS=0V
nA VGS=±20V, VDS=0V
V ID= 250â®A, VDS=VGS
â VGS= 10V, ID= 4.4A
â VGS= 4.5V, ID = 3.8A
S VDS= 15V, ID= 4.4A
pF
pF VDS= 40V, VGS=0V
f=1MHz
pF
ns
ns VDD= 35V, ID= 1A
ns RGâ
6.0â, VGS= 10V
ns
nC VDS= 35V, VGS= 5V
ID= 4.4A
nC
nC VDS=35V, VGS= 10V
ID= 4.4A
nC
V Tj=25°C, IS= 2.5A,
VGS=0V
ns Tj=25°C, IS= 2.5A,
nC di/dt=100A/â®s
NOTES:
(*) Measured under pulsed conditions. Pulse width Õ
300â®s; duty cycle Õ
2%.
(â ) Switching characteristics are independent of operating junction temperature.
(â¡) For design aid only, not subject to production testing.
Issue 2 - August 2006
4
© Zetex Semiconductors plc 2006
www.zetex.com
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