AN-112 Datasheet, PDF (1/2 Pages) IXYS Corporation – Ground-Start Supervision Circuit

Application Note
AN-112
Using Convection Ovens for Attaching Z-COMM VCOs
Introduction:
This application note is to provide a basic SMT process guideline for solder reflowing Z-Communications
voltage-controlled oscillators. The data provided complies with JEDEC J-STD-020 specification for peak
reflow requirements. Each board must be characterized to establish reliable profile and to ensure high
quality yields and product reliability. Both SnPb and Pb-free devices are covered in this document.
Printing Process:
The printing process for SnPb and Pb-free solder are identical. Various solder paste alloys are available in
the industry. SAC305 is a widely used Pb-free paste formulation due to its low melting temperature, good
fatigue resistance, and low cost. It is important to follow the specific requirements recommended by the
paste manufacturer.
Reflow Profile:
The convection oven reflow process involves careful setup to optimally shape the heating zones. By
following the suggested time and temperature profile (Figure AN-112:1), poor quality joints can be
minimized.
Figure 1: Oven Time-Temperature Reflow Profile
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