AN-107 Datasheet, PDF (1/1 Pages) Analog Devices – ACTIVE FEEDBACK IMPROVES AMPLIFIER PHASE ACCURACY

APPLICATION NOTE AN-107
MANUAL SOLDERING TECHNIQUE FOR Z-COMM VCOs
This note describes common manufacturing methods used to solder Z-COMM surface mount and pin mount
VCOs. Following the suggested practices will ensure optimum performance and repeated product reliability.
SURFACE MOUNT VCOs
The Mini, Sub-Mini, 375, USSP, and S package devices can be soldered manually or through an automated
process. Recommendations for both approaches are detailed below.
Manual Process:
Apply solder to the half-moon connections around the periphery of the VCO package (see figure 1). Once the
device's ground plane is heated, connection will normally require 5 seconds or less. For proper grounding, all of
the contacts must be soldered. Care must be taken to ensure good solder connections without applying excess
solder. Also, iron contact with VCO should be executed quickly to prevent heat damage.
figure 1:
Iron set for 250º C
Sn63 Solder
Apply iron for no more than 7 seconds after
ground plane is hot.
figure 2:
IR Reflow Process:
A typical solder stencil, as shown in figure 2, can be used to dis-
pense solder at the half-moon contacts. A reflow process with
appropriate IR reflow profile will ensure proper wetting and good
VCO/PCB contacts. Reflow of components within the device must
be avoided. All surface mount VCOs utilize Sn96.5/Sb3.5 solder
with a melting temperature of 217º C.
PIN MOUNT VCOs
Z-COMM Pin Mount VCOs utilize Sn96.5/Sb3.5 internally for pin connections. During VCO installation
special care must be taken not to overheat the contact pins as this will induce their upward movement into the
VCO. Also, similar to surface mount devices, the underside of the VCO must maintain intimate contact
with the system PCB. Any displacement will cause problems associated with inadequate grounding and/or
loading isolation.
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All rights reserved 2004