YB1900C Datasheet, PDF(7/9 Page) YOBON TECHNOLOGIES,INC. – Ultra Low Quiescent Current Smart Load Switch

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YB1900C Datasheet, PDF (7/9 Pages) YOBON TECHNOLOGIES,INC. – Ultra Low Quiescent Current Smart Load Switch

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YB1900C

Ultra Low Quiescent Current Smart Load Switch

In applications, where there is a possibility

of VOUT exceeding VIN for brief periods of

time during operation, the use of larger

value CIN capacitor is highly recommended.

A larger value of CIN with respect to COUT

will affect a slower CIN decay rate during

shutdown, thus preventing VOUT from

exceeding VIN.

In case of extended period of time for VOUT

exceeding VIN, it is recommended to place

a Schottky diode from VIN to VOUT.

Thermal Considerations

The YB1900C is designed to deliver a

continuous load current. The maximum

limit is package power dissipation. At any

given ambient temperature, the maximum

package power dissipation can be

determined by the following equation:

PD(MAX) = [TJ(MAX)-TA] / Î¸JA

Constraints for the YB1900C are maximum

junction temperature TJ(MAX) = 125â, and

package thermal resistance, Î¸JA = 220â/W.

The maximum continuous output current

for YB1900C depends on package power

dissipation and the RDS(ON) of MOSFET at

TJ(MAX). Typical conditions are calculated

under normal ambient condition where TA =

25â. At 85â, PD(MAX) = 181mW, and at TA

= 25â, PD(MAX) = 454mW.

The maximum current is calculated by the

following equation:

IOUT < (PD(MAX) / RDS(MAX))1/2

For example, if VIN = 5V, RDS(MAX) = 130mâ¦

and TA = 25 â , IOUT(MAX) = 1.8A. If

temperature is raised to 125â, the RDS(MAX)

will be increased to 180mâ¦ due to positive

temperature coefficient, and IOUT(MAX)

should be reduced to 1.5A.

If the output load current were very close to

IOUT(MAX) and the ambient temperature were

to increase, the internal die temperature

would increase, and the device would be

damaged.

PCB Layout Consideration

To maximize YB1900C performance, some

board layout rules should be followed:

VIN and VOUT should be routed using wider

than normal traces, and GND should be

connected to a ground plane. For best

performance, CIN and COUT should be

placed close to the package pins.

YB1900C Rev.1.4

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