S1AF Datasheet, PDF (1/2 Pages) SHIKE Electronics – Surface Mount General Purpose Silicon Rectifiers Reverse Voltage 50 to 1000 V Forward Current 1 A

YENYO
S1AF THRU S1MF
1.0A General Purpose Rectifier
1. 封裝 Package
 封裝方式 Method: SMAF
 封裝尺寸 Dimension: 如圖示
2. 產品特色 Features
 Low Forward voltage drop
 Easy pick and place
 High temperature soldering: 260℃/10 seconds at terminals
 Ultra thin profile package for space constrained utilization
 Package suitable for automated handling
 Glass passivated chip junction
 For surface mounted applications in order to optimize board space
 Lead‐free & halogen‐free parts, RoHS compliant
3. 機械數據 Mechanical Data
 Epoxy: UL94V‐0 rated flame retardant
 Case: Molded Plastic
 Terminals: Solder plated solderable per MIL‐STD‐750 Method 2026
 Mounting position: Any
 Polarity: Color band denotes cathode end
單位 Unit: millimeters
4. 極限值與電參數 Maximum Ratings & Electrical Characteristic
Rating at 25^OC ambient temperature unless otherwise specified. Single phase, half wave, 60Hz, resistive or
inductive load. For capacitive load, derate current by 20%.
PARAMETER
Repetitive Peak Reverse Voltage
RMS Voltage
DC Blocking Voltage
Average Forward Current
Peak Forward Surge Current :8.3ms single half
sine‐wave superimposed on rated load
Forward voltage at 1.0A
DC Reverse Current
DC blocking voltage
T_J=25^OC
Symbol S1AF
S1BF
S1DF
S1GF S1JF
S1KF
S1MF UNITS
V_RRM
50
100
200
400
600
800
1000
Volts
V_RMS
35
70
140
280
420
560
700
Volts
V_R
50
100
200
400
600
800
1000
Volts
I_F(AV)
1.0
Amps
I_FSM
30.0
Amps
V_F
1.1
Volts
I_R
3
uA
Typical thermal resistance, Junction to lead(Note 1)
Junction to ambient (Note 1)
Operating junction temperature and storage
temperature range
R_θJL
R_θJA
T_J, T_STG
20
83
‐55 to +150
O_C/W
O_C
Notes:
(1) Mounted on 48 cm² FR‐4 PCB.
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R2,JUL-15