BZT52C2V4 Datasheet, PDF (1/3 Pages) Diodes Incorporated – SURFACE MOUNT ZENER DIODE

DATA SHEET
SEMICONDUCTOR
BZT52C2V4-BZT52C51
SOD-123 Plastic-Encapsulate Diode
ZENER DIODE
SOD123 Unit:inch(mm)
FEATURES
Planar Die Construction
500mW Power Dissipation on Ceramic PCB
General Purpose Medium Current
Ideally Suited for Automated Assembly
Processes
High temperature soldering : 260^OC / 10 seconds at terminals
Pb free product at available : 99% Sn above meet RoHS
environment substance directive request
Maximum Ratings (Tamb=25 unless otherwise specified)
Symbol
A
A1
A2
b
c
D
E
E1
L
L1
θ
Characteristic
Forward Voltage @ IF = 10mA
Power Dissipation (Note 1)
Thermal Resistance, Junction to Ambient Air (Note 1)
Operating and Storage Temperature Range
Symbol
VF
Pd
RθJA
Tj, TSTG
Dimensions In Millimeters
Min
1.050
Max
1.250
0.000
0.100
1.050
1.150
0.450
0.650
0.080
0.150
1.500
1.700
2.600
2.800
3.550
3.850
0.500 REF
0.250
0.450
0°
8°
Value
0.9
500
305
-55 to +150
Dimensions In Inches
Min
0.041
Max
0.049
0.000
0.004
0.041
0.045
0.018
0.026
0.003
0.006
0.059
0.067
0.102
0.110
0.140
0.152
0.020 REF
0.010
0.018
0°
8°
Unit
V
mW
/W
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1
REV.02 20120403