NP396-500 Datasheet, PDF (1/1 Pages) Yamaichi Electronics Co., Ltd. – Shrink Ball Grid Array (1.27mm Pitch)

NP396 Series (Open Top) Shrink Ball Grid Array (1.27mm Pitch)
Specifications
Insulation Resistance:
1,000MW min. at 100V DC
Dielectric Withstanding Voltage: 100V AC for 1 minute
Contact Resistance:
30mW max. at 10mA/20mV max.
Operating Temperature Range: –55°C to +150°C
–40°C to +170°C
Contact Force:
13g per pin approx.
Operationg Force:
3.2 Kg
Mating Cycles:
10,000 insetions
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Outline Dimensions
Part Number (Details)
NP396 - 500 *
Series No.
No. of Contact Pins
Design Number
Features
í Open top type sockets for BGA packages
íCoverless shrink version
í2-point Tweezer Contact System
Recommended PC Board Layout
Top View from Socket
Recommended PC Board Layout
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Test & Burn-In