NP383-18010-N Datasheet, PDF (1/1 Pages) Yamaichi Electronics Co., Ltd. – Chip Scale Package -TH (CSP, 0.50mm Pitch)

NP383 Series (Open Top) Chip Scale Package -TH (CSP, 0.50mm Pitch)
Specifications
Insulation Resistance:
1,000MΩ min. at 100V DC
Dielectric Withstanding Voltage: 100V AC for 1 minute
Contact Resistance:
100mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Contact Force:
10gf per pin approx.
Operating Force:
2.2kg ±0.5
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyetherssulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Example Socket Dimensions
Features
µ Open top socket for BGA
µ Through hole 0.5mm pitch
µ 2-point Tweezer Contacts
Part Number (Details)
NP383 - *** 09 *
Series No.
No. of Contact Pins
Design Number
Positioning Pin: N = Without
P = With
Recommended PC Board Layout
Top View from Socket
Contact Details
2-point Tweezer Style Contact
Part Number
NP383-18010-*
NP383-28804-*
NP383-84107-*
Grid Size
10x18
18x18
29x29
Body size
11.0x12.5
10.0x10.0
15.0x15.0
Free
Open
Test
Socket Dimensions Centre Grid size
19.5x26.0
36.0x36.0
33.0x33
no grid centre
6x6
7x7
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Test & Burn-In