NP352-04808 Datasheet, PDF (1/8 Pages) Yamaichi Electronics Co., Ltd. – Fine Ball Grid Array (FBGA, 1.00mm Pitch)

NP352 Series (Open Top) Fine Ball Grid Array (FBGA, 1.00mm Pitch)
Specifications
Insulation Resistance:
1,000MW min. at 100V DC
Dielectric Withstanding Voltage: 100V AC for 1 minute
Contact Resistance:
100mW max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C / -55°C to +150°C
Contact Force:
15g per pin approx.
Mating Cycles:
10,000 insertions minimun
Part Number (Details)
NP352 - 560 09 - * - *
Series No.
No. of Contact Pins
Design Number
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Polyethersulphone (PES), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Mark for Positioning Pins
Contact Terminal Lengths and Form
Features
í Open top type sockets with "Tweezer Style Contacts"
For FBGA packages
í Secure package alignment due to self contacting structure
without upper pressing force (ZIF)
í Contacting structure to nip the sides of solder balls to lower
damages of coplanarity of solder balls
Outline Base Socket Dimensions
A±0.4
Yamaichi's 2-point Tweezer Contact
IC
Ball
Socket
Base A
Contacts
Socket
Base B
Since the solder balls are touched
by two contacts on each side,
the solder ball damage can be
minimized; additional features
are low actuation force and
compact socket size
D-36 Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER