NP178-64401-1-MF Datasheet, PDF (1/1 Pages) Yamaichi Electronics Co., Ltd. – Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)

NP178 Series (Open Top) Pin Grid Array /Zero Insertion Force (PGA/ZIF - Interstitial)
Specifications
Insulation Resistance:
1,000MW min. at 500V DC
Dielectric Withstanding Voltage:700V AC for 1 minute
Contact Resistance:
30mW max. at 10mA/20mV max.
Operating Temperature Range: –55°C to +170°C
Contact Force:
30g min. per pin at minimun
displacement of 0.45mm
90g max. per pin at maximum
displacement of 0.8mm
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Part Number (Details)
NP178 - 644 01 - *
Series No.
- **
No. of Contact Pins
Design Number
Matching IC Diameter /Socket Pin Length
1 : Æ0.35±0.05
1: L = 3.3
2 : Æ0.45±0.05
2: L = 3.8
MF =Flanged
Unmarked = Not Flanged
Outline Socket Dimensions
A
B
C
1.27
Recommended PC Board Layout
Top View from Socket
NP178-64401-*-**
78.00±0.1
26.0±0.05
24.0±0.05
3-Æ1.5
+0.1
0
Æ3.0 Depth 3.0
4- Æ2.2
644-Æ0.7
+0.1
0
4-
Æ2.2
+0.1
0
1.27±0.05
1.27x36=45.72±0.1
NP178-72002-*-**
79.00±0.1
52.0±0.1
1.27±0.05
14.3±0.05
3-Æ1.5
+0.1
0
Initial Position of Cover
Æ1.45
Pressed Down Position of Cover
L: 1 = 3.3
2 = 3.8
T 0.2 x W 0.5
Part Number
NP178-64401-*-**
NP178-72002-*-**
Grid
Size
19 x 19
20 x 20
Pin
Count
644
720
720-Æ0.7^+00.1
4-
Æ2.2
+0.1
0
1.27x38=48.26±0.1
Outline IC Dimensions
E
1.30±0.05
14.75±0.05
H
F
Socket Dimensions
AB
C
D
78.0 74.0 1.27x36=45.72 67.0
79.0 75.0 1.27x38=48.26 69.5
IC Dimensions
E max. F
G
H
50.0 45.72 2.54~5.9 1.27
52.8 48.26 2.54~5.9 1.27
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER