IC70-0726-G4 Datasheet, PDF (1/1 Pages) Yamaichi Electronics Co., Ltd. – Single Inline Package (SIP)

IC70 Series
Single Inline Package (SIP)
Specifications
Insulation Resistance:
1,000MW min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30mW max. at 10mA/20mV max.
Current Rating:
1A max.
Operating Temperature Range: –40°C to +150°C
Mating Cycles:
10,000 insertions min.
Materials and Finish
Housing: Polysulphone (PSF), glass-filled - UL94V-0
Contacts: Beryllium Copper (BeCu)
Plating: Gold (0.3µm min.) over Nickel (2.5 to 4.5µm min.)
Features
í Dual wipe contacts ensure high reliability
í Low costs due to selective gold plating
Part Number (Details)
IC70 _- 30 11 MF _- G 4
Series No.
No. of Contact Pins
Design Number
MF = Flanged
Unmarked = Not Flanged
Contact Plating (G = Gold Plating)
Straight, Through Hole Type
Outline Socket Dimensions
A
B
C
D
E
2- Æ3.5
0.8
Outline Socket Dimensions for IC70-5616-G4 only ¹⁾
May be cut at points marked by ý into 3 separate sections
125.0
116.0
1.78 x 55 = 97.9
1.78
0.7
ýý
Æ3.2
1.78 x 23 = 40.94
1.78 x 23 = 40.94
1.78 x 7 = 12.46
102.0
13.36
0.5 x 0.46
0.5 x 0.46
Recommended PC Board Layout
2- Æ3.5
B
D
E
Top View from Socket
Pin Count Æ0.8
Part Number Pin Count
IC70-0726**-G4
7
IC70-1217**-G4
12
IC70-1521**-G4
15
IC70-2020**-G4
20
IC70-2313**-G4
23
IC70-2418**-G4
24
IC70-3011**-G4
30
IC70-3015**-G4
30
IC70-3019**-G4
30
IC70-4014**-G4
40
IC70-5616**-G4¹⁾
56
A
26.6
41.0
36.8
47.5
44.0
63.0
77.0
57.0
62.5
94.0
125.0
B
19.6
34.0
29.8
40.5
38.0
57.0
67.0
49.0
55.5
84.0
116.0
C
12.6
27.0
22.8
33.5
32.0
51.0
57.0
41.0
48.5
74.0
102.0
D
1.27 x 6 = 7.62
2.00 x 11 = 22.00
1.27 x 14 = 17.78
1.50 x 19 = 28.50
1.27 x 22 = 27.94
2.00 x 23 = 46.00
1.80 x 29 = 52.20
1.27 x 29 = 36.83
1.50 x 29 = 43.50
1.778 x 55 = 69.342
1.78 x 55 = 97.90
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
E
1.27
2.0
1.27
1.5
1.27
2.0
1.8
1.27
1.5
1.778
1.78