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IC51-0444-798 Datasheet, PDF (1/6 Pages) Yamaichi Electronics Co., Ltd. – Series Overview QFP (Quad Flat Packages, Gullwing Leads)
SMT Devices
Series Overview
*QFP (Quad Flat Packages, Gullwing Leads)
Series IC51 (Clamshell)
QFP, PQFP, TQFP and MQUAD®
*QFP variations e.g. BQFP...
0.4mm to 1.27 Pitch
Speci cations
Insulation Resistance:
1,000MΩ min. at 100V DC
Dielectric Withstanding Voltage: for 1 minute (socket depended)
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C (for type PEI/PSF)
–55°C to +170°C (for type PES)
–55°C to +170°C (for type PEI)
Mating Cycles:
10,000 insertions min.
Materials and Finish
Housing: Polysulphone (PSF), glass- lled
Polyethersulphone (PES), glass- lled
Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Part Number (Details)
IC51 - 064 4 - 807
Series No.
No. of Contact Pins
Number of Sides
with Contacts
Design Number
As speci cations for this product differ by pitch
and material-mix, please contact our Sales Department
for detailed information.
Series IC51 (Clamshell)
Bumper Quad Flat Packages (BQFP)
Speci cations
Insulation Resistance:
1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Current Rating:
1A max.
Operating Temperature Range: –55°C to +170°C
Mating Cycles:
25,000 insertions min.
Contact Force:
50g to 150g per pin
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
0.635mm Pitch
Part Number (Details)
IC51 - 100 4 - 827
Series No.
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Series IC211 (Open Top)
Bumper Quad Flat Packages (BQFP)
Speci cations
Insulation Resistance:
1,000MΩ min. at 500V DC
Dielectric Withstanding Voltage: 500V AC for 1 minute
Contact Resistance:
30mΩ max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +170°C
Contact Force:
20g to 80g per pin
Mating Cycles:
10,000 insertions min.
Materials and Finish
Housing: Polyetherimide (PEI), glass- lled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
0.635mm Pitch
Part Number (Details)
IC211 - 132 4 - 002
Series No.
* -*
No. of Contact Pins
Number of Sides
with Contacts
Design Number
Positioning Pin:
N = Without Positioning Pin
Unmarked = With Positioning Pin
Protection Key* *
K = With Protection Key
Unmarked = Without Protection Key
.. Test & Burn-In
**Protection Key: Prevents IC from releasing during transportation
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER