IC264-22501-1 Datasheet, PDF (1/1 Pages) Yamaichi Electronics Co., Ltd. – Ball Grid Array (BGA, 1.50mm Pitch)

IC264 Series (Open Top) Ball Grid Array (BGA, 1.50mm Pitch)
Specifications
Insulation Resistance:
1,000MW min. at 100V DC
Dielectric Withstanding Voltage: 100V AC for 1 minute
Contact Resistance:
1W max. at 10mA/20mV max.
Operating Temperature Range: –40°C to +150°C
Mating Cycles:
10,000 insertions min.
Pin Count:
225 contact pins
Contact Force:
25g to 35g per individual
contact pin
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Part Number (Details)
IC264 - 225 01 - 1 - ** - MF
Series No.
No. of Contact Pins
Design Number
NN: Without Positioning Pin #1, #2
NP: Without Positioning Pin #1,
With Positioning Pin #2
PN: With Positioning Pin #1,
Without Positioning Pin #2
Blank: With Positioning Pin #1, #2
MF = Flanged
Unmarked = Not Flanged
Outline Socket Dimensions
56.0±0.1
25.0
4- Æ2.8
50.0
4-R 3.0
Matching IC Dimensions
Æ0.75±0.1
1.50±0.1
1.50x14=21.00
27.00 ±0.2
Recommended PC Board Layout
IC264-22501-1-**-**
4-
Æ2.8
+0.1
0
56.0±0.05
32.5±0.05
Top View from Socket
4-
Æ2.0
+0.1
0
Test & Burn-In
225-
Æ0.6
+0.1
0
28.0±0.05
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
2-
Æ1.5
+0.1
0