IC-554-1-MF Datasheet, PDF (1/1 Pages) Yamaichi Electronics Co., Ltd. – Dual InlineMemoryModule (DIMM, 72 pins)

IC554 Series
Dual Inline Memory Module (DIMM, 72 pins)
Specifications
Insulation Resistance:
1,000MW min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
30mW max. at 10mA/20mV max.
Operating Temperature Range: –55°C to +170°C
Mating Cycles:
10,000 insertions min.
Pin Count:
72 contact pins
Materials and Finish
Housing: Polyetherimide (PEI), glass-filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
í Card thickness 1.00mm
Part Number (Details)
IC-554 - 1 - MF
Series No.
1 = 72 Pins
MF = Flanged
Unmarked = Not Flanged
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
Æ3.20⁺
0.1
0
R 1.50
89.00 ±0.2
1.27x35=44.45 ±0.2
1.27x17=21.59 Ref 1.27x18=22.86 Ref
1.27 ±0.1
Æ3.20
+ 0.1
0
Thru hole
89.00 ±0.1
1.27x35=44.45 ±0.1
(1.27x17=21.59)
(1.27x18=22.86)
1.27 ±0.05
0.635 ±0.05
72-Æ0.80
+ 0.1
0
1.27 ±0.1
0.67⁺
0.1
0
1.27x 35=44.45 ±0.2
80.00 ±0.4
98.00 ±0.4
80.00 Ref
59.89
+
0.1
0
55.90 Ref
Front
1.27±0.05
1.27x35=44.45 ±0.05
Matching Module Dimensions
59.69
3.70 ±0.5
54.00
+
0.2
0
Back
w0.40 x t0.30
Front
7.62
(1.27x17=21.59)
2.00
1.02 ±0.3
1.27 ±0.3
44.45 ±0.05
51.66
1.27x35=44.45 ±0.05
Back
1.00 + 0.09
– 0.07
(1.27x18=22.86)
Æ1.80±0.05
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER
Test & Burn-In